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AMIS-42673 High Speed CAN Transceiver
For Long Networks 1.0 Introduction
Data Sheet
The AMIS-42673 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus. It may be used in both 12V and 24V systems. The digital interface level is powered from a 3.3V supply providing true I/O voltage levels for 3.3V CAN controllers. The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. Due to the wide common-mode voltage range of the receiver inputs, the AMIS-42673 is able to reach outstanding levels of electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of the output signals. The AMIS-42673 is primarily intended for applications where long network lengths are mandatory. Examples are elevators, in-building networks, process control and trains. To cope with the long bus delay the communication speed needs to be low. AMIS-42673 allows low transmit data rates down to 10 kbit/s or lower.
2.0 Key Features
* * * * * * * * * * * * True 3,3V or 5,0V logic level interface Fully compatible with the "ISO 11898-2" standard Wide range of bus communication speed (0 up to 1Mbit/s) Allows low transmit data rate in networks exceeding 1 km Ideally suited for 12V and 24V applications Low electromagnetic emission (EME). Common-mode-choke is no longer required Differential receiver with wide common-mode range (+/- 35V) for high electromagnetic susceptibility (EMS) No disturbance of the bus lines with an un-powered node Thermal protection Bus pins protected against transients Short circuit proof to supply voltage and ground ESD protection for CAN bus at 8 kV
3.0 Technical Characteristics
Table 1: Technical Characteristics www..com Symbol Parameter DC voltage at pin CANH VCANH DC voltage at pin CANL VCANL Differential bus output voltage in Vi(dif)(bus_dom) dominant state tpd(rec-dom) Propagation delay TxD to RxD Propagation delay TxD to RxD tpd(dom-rec) Input common-mode range for CM-range comparator
Conditions 0 < VCC < 5.25V; no time limit 0 < VCC < 5.25V; no time limit 42.5 < RLT < 60 Figure 7 Figure 7 Guaranteed differential receiver threshold and leakage current Figure 8 and Figure 9 (Note 1) Figure 8 and Figure 9 (Note 1)
Min
-45 -45 1.5 100 100 -35 -500 -150
Max
+45 +45 3 230 245 +35 500 150
Unit
V V V ns ns V mV mV
VCM-peak VCM-step
Common-mode peak Common-mode step
Note 1: The parameters VCM-peak and VCM-step guarantee low EME.
4.0 Ordering Information
Ordering Code (Tubes) 0ICAG-001-XTD Ordering Code (Tape) 0ICAG-001-XTP Marketing Name AMIS 42673AGA Package SOIC-8 GREEN Temp. Range -40C...125C
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AMIS-42673 High Speed CAN Transceiver
For Long Networks 5.0 Block Diagram
VCC AMIS-42673
VCC
Data Sheet
3 Thermal shutdown
TxD
1 7 'S' Driver control 6
CANH CANL
V33
8
RxD VREF
4
COMP
Ri(cm) +
Vcc/2
5
Ri(cm) 2
PC20071003.2
GND
Figure 1: Block Diagram
6.0 Typical Application
6.1 Application Schematic
VBAT
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IN
5V-reg
OUT
60
60 47 nF
IN
3.3Vreg
OUT VCC RxD
4 8
V33
3
VCC
7
CAN BUS
CANH VREF CANL 60 60 47 nF
CAN controller
PC20071003.3
TxD
AMIS42673
1 2
5 6
GND
GND
Figure 2: Application Diagram
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AMIS-42673 High Speed CAN Transceiver
For Long Networks
6.2 Pin Description 6.2.1. Pin Out (top view)
Data Sheet
TxD GND VCC RxD
1
8
V33 CANH CANL VREF
AMIS42673
Figure 3: Pin Configuration
2 3 4
7 6 5
PC20071003.1
6.2.2. Pin Description
Table 2: Pin Out Pin Name 1 TxD 2 GND 3 VCC 4 RxD 5 VREF 6 CANL 7 CANH 8 V33
Description Transmit data input; low input dominant driver; internal pull-up current Ground Supply voltage Receive data output; dominant transmitter low output Reference voltage output LOW-level CAN bus line (low in dominant mode) HIGH-level CAN bus line (high in dominant mode) 3.3V supply for digital I/O
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AMIS-42673 High Speed CAN Transceiver
For Long Networks 7.0 Functional Description
7.1 General
Data Sheet
The AMIS-42673 is the interface between the CAN protocol controller and the physical bus. It is intended for use in industrial and automotive applications requiring baud rates up to 1Mbit/s. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the "ISO 11898-2" standard. 7.2 Operating Modes AMIS-42673 only operates in high-speed mode as illustrated in Table 3. The transceiver is able to communicate via the bus lines. The signals are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus lines outputs are optimised to give extremely low EME.
Table 3: Functional table of AMIS-42673; X = don't care VCC pin TxD pin CANH 4.75 to 5.25.V 0 High 4.75 to 5.25.V 1 (or floating) VCC/2 VCC2V 0Vpin CANL Low VCC/2 0VBus state Dominant Recessive Recessive Recessive
pin RxD 0 1 1 1
7.3 Over-temperature Detection A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 160C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes HIGH. The thermal protection circuit is particularly needed when a bus line short circuits. 7.4 High Communication Speed Range The transceiver is primarily intended for industrial applications. It allows very low baud rates needed for long bus length applications. But also high speed communication is possible up to 1Mbit/s. 7.5 Fail-safe Features
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A current-limiting circuit protects the transmitter output stage from damage caused by accidental short-circuit to either positive or negative supply voltage - although power dissipation increases during this fault condition. The pins CANH and CANL are protected from automotive electrical transients (according to "ISO 7637"; see Figure 4). Should TxD become disconnected, this pin is pulled high internally. When the Vcc supply is removed, pins TxD and RxD will be floating. This prevents the AMIS-42673 from being supplied by the CAN controller through the I/O pins. 7.6 3.3V Interface AMIS-42673 may be used to interface with 3.3V or 5V controllers by use of the V33 pin. This pin may be supplied with 3.3V or 5V to have the corresponding digital interface voltage levels. When the V33 pin is supplied at 2.5V, even interfacing with 2.5V CAN controllers is possible. See also Digital Output Characteristics @ V33 = 2.5V, Table 7. In this case a pull-up resistor from TxD to V33 is necessary.
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AMIS-42673 High Speed CAN Transceiver
For Long Networks 8.0 Electrical Characteristics
8.1 Definitions
Data Sheet
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means that the current is flowing into the pin. Sourcing current means that the current is flowing out of the pin. 8.2 Absolute Maximum Ratings Stresses above those listed in Table 4 may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may effect device reliability.
Table 4: Absolute Maximum Ratings Symbol Parameter Supply voltage VCC I/O interface voltage V33 DC voltage at pin CANH VCANH DC voltage at pin CANL VCANL DC voltage at pin TxD VTxD DC voltage at pin RxD VRxD VREF DC voltage at pin VREF Transient voltage at pin CANH Vtran(CANH) Transient voltage at pin CANL Vtran(CANL) Transient voltage at pin VREF Vtran(VREF) Electrostatic discharge voltage at Vesd(CANL/CANH) CANH and CANL pin Electrostatic discharge voltage at all Vesd other pins Latch-up Static latch-up at all pins Storage temperature Tstg Ambient temperature Tamb Maximum junction temperature Tjunc
Notes:
Conditions
0 < VCC < 5.25V; no time limit 0 < VCC < 5.25V; no time limit
Note 1 Note 1 Note 1 Note 2 Note 5 Note 3 Note 5 Note 4
Min. -0.3 -0.3 -45 -45 -0.3 -0.3 -0.3 -150 -150 -150 -8 -500 -4 -250
-55 -40 -40
Max. +7 +7 +45 +45 VCC + 0.3 VCC + 0.3 VCC + 0.3 +150 +150 +150 +8 +500 +4 +250 100 +155 +125 +150
Unit V V V V V V V V V V kV V kV V mA C C C
www..com 2) Standardized human body model system ESD pulses in accordance to IEC 1000.4.2.
1) Applied transient waveforms in accordance with "ISO 7637 part 3", test pulses 1, 2, 3a, and 3b (see Figure 4). 3) Standardized human body model ESD pulses in accordance to MIL883 method 3015. Supply pin 8 is 4kV. 4) Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78. 5) Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.
8.3 Thermal Characteristics
Table 5: Thermal Characteristics Symbol Parameter Thermal resistance from junction to ambient in SO8 package Rth(vj-a) Thermal resistance from junction to substrate of bare die Rth(vj-s)
Conditions In free air In free air
Value 145 45
Unit K/W K/W
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AMIS-42673 High Speed CAN Transceiver
For Long Networks
8.4 DC Characteristics
VCC = 4.75 to 5.25V; V33 = 2.9V to 3.6V; Tjunc = -40 to +150 C; RLT = 60 unless specified otherwise Table 6: Characteristics Symbol Parameter Supply (pin VCC and pin V33)
Data Sheet
Conditions
Min.
Typ.
Max.
Unit
ICC I33 I33
Supply current I/O interface current I/O interface current
(1)
Dominant; VTXD = 0V Recessive; VTXD = VCC V33 = 3.3V; CL = 20pF; recessive V33 = 3.3V; CL = 20pF; 1Mbps Output recessive Output dominant VTxD = V33 VTxD = 0V 2.0 -0.3 -1 -50 0.7 x V33 -10 5 0.45 x VCC 0.40 x VCC 2.0 2.0 -2.5 -2.5 3.0 0. 5 1.5 -120 -45 45 0.5
45 4
65 8 1 170
mA mA
A A
Transmitter Data Input (pin TxD) HIGH-level input voltage VIH LOW-level input voltage VIL HIGH-level input current IIH LOW-level input current IIL (1) Input capacitance Ci Receiver Data Output (pin RxD)
0 -200 5 0.75 x V33 0.18 -15 10 0.50 x VCC 0.50 x VCC 2.5 2.5 3.6 1.4 2.25 0 -70 70 0.7
VCC +0.8 +1 -300 10
V V A A pF V
VOH VOL Ioh Iol
HIGH-level output voltage
IRXD = - 10mA IRXD = 5mA VRxD = 0.7 x V33 VRxD = 0.45V
-50A < IVREF < +50A -35V < VCANH < +35V; -35V < VCANL < +35V
LOW-level output voltage (1) HIGH-level output current (1) LOW-level output current Reference Voltage Output (pin VREF)
0.35 -20 15 0.55 x VCC 0.60 x VCC 3.0 3.0 +2.5 +2.5 4.25 1.75 3.0 +50 -95 120 0.9
V mA mA V V V V mA mA V V V mV mA mA V
VREF VREF_CM
Reference output voltage
Reference output voltage for full commonmode range Bus Lines (pins CANH and CANL) Recessive bus voltage at pin CANH Vo(reces)(CANH) Recessive bus voltage at pin CANL Vo(reces)(CANL)
Io(reces) (CANH) Io(reces) (CANL)
Recessive output current at pin CANH Recessive output current at pin CANL
www..com Dominant output voltage at pin CANH Vo(dom) (CANH) Dominant output voltage at pin CANL Vo(dom) (CANL)
Vi(dif) (bus) Io(sc) (CANH) Io(sc) (CANL) Vi(dif)(th) Vihcm(dif) (th) Vi(dif) (hys) Ri(cm)(CANH) Ri(cm) (CANL) Ri(cm)(m) Ri(dif)
Differential bus input voltage (VCANH VCANL) Short circuit output current at pin CANH Short circuit output current at pin CANL Differential receiver threshold voltage
Differential receiver threshold voltage for high common-mode Differential receiver input voltage hysteresis Common-mode input resistance at pin CANH Common-mode input resistance at pin CANL Matching between pin CANH and pin CANL common-mode input resistance Differential input resistance
0V < VCC < 5.25V -35V < VCANL < +35V; 0V < VCC < 5.25V VTxD = 0V VTxD = 0V VTxD = 0V; dominant; 42.5 < RLT < 60 VTxD = VCC; recessive; no load VCANH = 0V;VTxD = 0V VCANL = 36V; VTxD = 0V -5V < VCANL < +12V; -5V < VCANH < +12V; see Figure 5 -35V < VCANL < +35V; -35V < VCANH < +35V; see Figure 5 -35V < VCANL < +35V; -35V < VCANH < +35V; see Figure 5
VTxD = VCC; no load VTxD = VCC; no load -35V < VCANH < +35V;
0.25
0.7
1.05
V
50 15 15
70 25 25 0 50
100 37 37 +3 75
mV K K % K
VCANH = VCANL
-3 25
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AMIS-42673 High Speed CAN Transceiver
For Long Networks
Table 7: Characteristics (Continued) Symbol Parameter Bus Lines (pins CANH and CANL) Input capacitance at pin CANH Ci(CANH) Input capacitance at pin CANL Ci(CANL) Differential input capacitance Ci(dif) Input leakage current at pin CANH ILI(CANH) Input leakage current at pin CANL ILI(CANL) Common-mode peak during transition from VCM-peak dom rec or rec dom Difference in common-mode between VCM-step dominant and recessive state Power on Reset PORL POR level
Conditions Min. Typ. Max.
Data Sheet
Unit
VTxD = VCC; not tested VTxD = VCC; not tested VTxD = VCC; not tested VCC = 0V; VCANH = 5V VCC = 0V; VCANL = 5V
Figure 8 and Figure 9 Figure 8 and Figure 9 CANH, CANL, Vref in tristate below POR level
10 10 -500 -150
7.5 7.5 3.75 170 170
20 20 10 250 250 500 150
pF pF pF A A mV mV
2.2 150 40 30 25 65 100 100
3.5 160 85 60 55 100
4.7 180 110 110 110 135 230 245
V C ns ns ns ns ns ns
Thermal Shutdown shutdown junction temperature Tj(sd) Timing Characteristics (see Figures 6 and 7) Delay TxD to bus active td(TxD-BUSon) Delay TxD to bus inactive td(TxD-BUSoff) Delay bus active to RxD td(BUSon-RxD) Delay bus inactive to RxD td(BUSoff-RxD) Propagation delay TxD to RxD from tpd(rec-dom) recessive to dominant Propagation delay TxD to RxD from td(dom-rec) dominant to recessive
Note: 1) Not tested at ATE
VCC = 4.75 to 5.25V; V33 = 2.5V 5%; Tjunc = -40 to +150 C; RLT = 60 unless specified otherwise.
Table 8: Digital Output Characteristics @ V33 = 2.5V Symbol Parameter Receiver Data Output (pin RxD) HIGH-level output current Ioh LOW-level output current Iol
Conditions Min. Typ. Max. Unit
VOH > 0.9 x V33 VOL < 0.1 x V33
-2.6 4
mA mA
8.5 Measurement Set-ups and Definitions
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+3.3 V +5 V 100 nF TxD VCC
3 1
100 nF V33
8 7
CANH 1 nF VREF 1 nF
AMIS42673
RxD
4 2
5
Transient Generator
6
CANL
PC20071003.4
20 pF
GND
Figure 4: Test Circuit for Automotive Transients
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AMIS-42673 High Speed CAN Transceiver
For Long Networks
VRxD High Low
Hysteresis PC20040829.7
Data Sheet
0,5
0,9
Vi(dif)(hys)
Figure 5: Hysteresis of the Receiver
+3.3 V +5 V 100 nF VCC
3
100 nF V33
8 7 1
TxD
CANH RLT VREF 60 CLT 100 pF
AMIS42673
RxD
4 2
5
6
CANL
PC20071003.5
20 pF
GND
Figure 6: Test Circuit for Timing Characteristics
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HIGH LOW
TxD
CANH
CANL
dominant
Vi(dif) = VCANH - VCANL
0,9V
0,5V recessive
RxD td(TxD-BUSon) tpd(rec-dom)
0,3 x V33 0,7 x V33
td(TxD-BUSoff) td(BUSon-RxD) tpd(dom-rec) td(BUSoff-RxD)
PC20040829.6
Figure 7: Timing Diagram for AC Characteristics
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AMIS-42673 High Speed CAN Transceiver
For Long Networks
Data Sheet
+3.3 V +5 V VCC
3
100 nF V33
8 7 1
TxD
CANH
6.2 k 10 nF Active Probe
Generator RxD
4
AMIS42673
CANL 6 6.2 k
5
Spectrum Anayzer
2
30 VREF
30
20 pF
GND
47 nF
PC20071003.6
Figure 8: Basic Test Set-up for Electromagnetic Measurement
CANH
CANL
recessive
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Vi(com) = VCANH + VCANL VCM-peak
VCM-step
VCM-peak
PC20040829.7
Figure 9: Common-mode Voltage Peaks (see measurement set-up Figure 8)
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AMIS-42673 High Speed CAN Transceiver
For Long Networks 9.0 Package Outline
SOIC-8: Plastic small outline; 8 leads; body width 150 mil; JEDEC: MS-012
Data Sheet
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AMIS-42673 High Speed CAN Transceiver
For Long Networks 10.0 Soldering
10.1 Introduction to Soldering Surface Mount Packages
Data Sheet
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards (PCB) with high population densities. In these situations re-flow soldering is often used. 10.2 Re-flow Soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250C. The top-surface temperature of the packages should preferably be kept below 230C. 10.3 Wave Soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the PCB; o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the PCB. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 10.4 Manual Soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300C. www..com
Table 9: Soldering Process
Package Soldering Method Wave Not suitable (2) Not suitable Suitable (3)(4) Not recommended (5) Not recommended Re-flow Suitable Suitable Suitable Suitable Suitable
(1)
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320C.
BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS (3) PLCC , SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO
Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods." 2. These packages are not suitable for wave soldering as a solder joint between the PCB and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm.
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AMIS-42673 High Speed CAN Transceiver
For Long Networks 11.0 Company or Product Inquiries
Data Sheet
For more information about AMI Semiconductor's Industrial CAN Transceivers, visit our Web site at http://www.amis.com.
12.0 Revision History
Date October 2007 Revision 1.0 Change Initial release
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Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such applications. Copyright (c)2007 AMI Semiconductor, Inc.
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